Our client is celebrating its 25th year as a high tech manufacturer of semiconductor equipment, which is sold globally. The equipment performs wafer bonding; a process used in the production of most microelectronic silicon chips, sensors, LEDs, microfluidic devices etc., found in all electronic devices including e.g. mobile phones

The Role:

  • Wide ranging and varied
  • Design Drawings to improve the products and develop new products using Solidworks, CAD
  • Input to machine improvement with reference to build and performance.
  • Looking for a degree qualified engineer, with electrical & mechanical skills & experience, to work in the development & manufacture of high tech semiconductor equipment.

Key Skills, Education and Experience

  • Mechanical or Electrical Engineering degree or HNC or similar with extensive job related experience.
  • Strong Engineering back ground
  • Meticulous, attentive to detail & used to working with quality systems
  • Intelligent and professional
  • Mechanical Design 5 years

Location: Oxfordshire

Salary: Competitive

Contract: Permanent

So if you feel you have the necessary skills click the apply button today!

Keywords: Design Engineer, CAD Draughtsperson, CAD Draughtsman, CAD, CAD Design, AutoCAD, CAD Draughter, Design, Wafer Bonding, Mechanical Design, Electrical Design, Engineer, 

To apply for this job email your details to info@hemscottassociates.com